tML-system platform with SN single-fibre connector now available
Dortmund/Germany, 12 January 2022. tde – trans data elektronik is the first network expert to provide a fibre optic SN module for its successful tML-Standard, tML24 and tML-Xtended cabling platforms. For this purpose, tde has integrated the compact SN connector from Senko into its tML system platform. The result: with 384 fibres on one height unit in the patch area, the packing density is doubled compared to LC duplex connectors. Companies and network engineers thus save valuable space in data centres. In the rear area, the new module relies on the proven MPO technology with plug-and-play functionality.
With the new tML fibre optic SN module, tde underlines its innovative claim to always offer customers the highest packing density in the industry: The technology pioneer and long-standing and trusted partner of Senko combines the advantage of the highly compact SN single-fibre connector with their tML systems. By easily replacing and upgrading existing tML systems with LC duplex modules with fibre optic SN modules, customers get the highest packing density with single fibre connectors currently on the market. “The demands on data centres are enormous: in addition to ever higher transmission rates, the highest packing density and better manageability, they must also make optimal use of the existing, valuable space and take the aspect of green IT into account. With the new fibre optic SN module, we now offer data centres an innovative solution for high-density applications and future-proof high-speed networks with transmissions of currently up to 400G,” says Andre Engel and continues: “The tML fibre optic SN module once again significantly increases the packing efficiency of our scalable tML system in the patch area.”
Thanks to the compact design of the SN connector, 24 x fibre optic SN connectors with 48 fibres can be accommodated in a tML module as well as 192 x 2 fibres with a total of 384 fibres on a 19-inch height unit. “This is a doubling of the packing density compared to the use of LC duplex connectors.” explains Andre Engel. “Incidentally, we also ensure this packing efficiency with our tML fibre optic MDC module introduced in 2020.”
In addition, the new tML fibre optic SN module enables a quadrupling of port density compared to the industry standard. In the rear area, the tML modules rely on the proven MPO technology. The tML24 system integrates two 24-fibre MPOs. This results in drastic savings in expensive space, which also does not need to be air-conditioned, combined with more green IT.
Senko has designed the very narrow connector based on the proven 1.25 mm ferrule technology for the new generation of high-density transceivers OSFP (Octal Small Format Pluggable) and QSFP DD (Quad Small Form Factor Pluggable Double Density) with transmission rates of up to 400G. This gives network engineers options for breakout applications by dividing the transmission rates into channels with lower channel speed. This allows for more efficient use of active component chassis with higher port numbers and packing densities. “We are pleased that with the successful SN as well as the MDC integration in 2020, we are giving customers the choice of which paths they want to migrate to high-speed transmissions up to 400G currently,” says Andre Engel. “Nevertheless, high-fibre MPO cabling in the rear area with flexible modular technology remains the future-proof and investment-proof solution – if it integrates all connectors currently available on the market.”
